As the competition for dressing chips is getting hotter and hotter, mid-stream packaging companies are thinking about how to get rid of the increase in revenue, a new chip packaging process has attracted the attention of the industry, and even many industry insiders predict that this process will become the future. The mainstream technology of LED packaging, this is the flip chip process. This change is especially evident this year. In the past few years, only manufacturers with flip-chip technology as technology reserves, such as Ronda, Jingdian, and cross-strait optoelectronics, have launched new products based on flip chip technology, which further confirms the spring market of flip chip. . Mr. Tang Guoqing, the general manager of Samsung LED China, made it clear that: 2014 LED flip chip technology is prevalent, its technical performance advantages and future market prospects will be more and more concerned by chips and packaging manufacturers, and will accelerate the LED packaging revolution. . The development of flip chip Flipchip originated in the 1960s and was first developed by IBM and used in IC and some semiconductor products. The specific principle is to deposit tin shots on the I/Opad and then flip the chip to heat it. Using a combination of molten tin shot balls and ceramic plates, this technology has replaced conventional wire bonding and is becoming a trend in the future. Philips Lumileds introduced the flip-chip process to the LED field for the first time in 2006. Since then, flip-chip eutectic technology has evolved and penetrated into chip-scale packages, creating a concept of package-free. It is based on the many advantages that flip-chip LEDs have unparalleled advantages in dressing chips. In recent years, many chip factories are actively researching and developing related products. Philips Lumileds and CREE have already launched products, and some mainstream LED manufacturers are Most of the high-power products market uses flip-chip structures, and the top products on the market have always been occupied by flip-chip products. However, it is rare in the small and medium power civilian market. This is mainly limited by the flip chip soldering process. The early flip chip is mainly composed of AuSn eutectic soldering and Goldtogoldinterconnect (gold-to-gold connection). The AuSn eutectic soldering equipment is expensive and the yield is low; Goldtogoldinterconnect (gold to gold) Connection) The reliability is good, but the equipment is expensive, the cost is high, and it cannot be promoted on a large scale. Industry experts believe that. The yield is low and the cost is high. Although it has obvious advantages, the flip chip can only be applied to the high-power LED market with relatively high premium. In addition, the technical reserve is mainly in international manufacturers, which greatly limits the flip chip. Application in the domestic market. In the era of change, however, the emergence of solder paste soldering has changed everything. The latest solder paste soldering process has solved some difficulties in the flip chip process, greatly improving the reliability and stability of the product, which has also attracted the attention of the industry. Some domestic companies have begun to flip. Research in the field of chips has also achieved certain results. This has also laid a good foundation for increasing the popularity of the flip chip market. Industry experts pointed out. The solder paste soldering process directly uses solder paste instead of silver paste to solidify the crystal, which simplifies the manufacturing process and the program, saves the solid crystal baking process and the wire bonding process, and the device is relatively open, which is a flip chip process. The upgrade offers more possibilities, and the price/performance ratio of flip-chips is gradually being pulled to the same level as market expectations. Deng Qiai revealed that Cross-Strait Optoelectronics has taken the lead in mastering the solder paste soldering process in China, and continues to actively develop R&D innovation around flip chip, which continues to strengthen the advantages of flip chip, such as more outstanding thermal performance, higher reliability, and simplicity. Fast manufacturing, better electrical performance, and relatively large light-emitting area. With the maturity of the process and the unremitting efforts of some domestic enterprises in the field of flip-chip research and development, the cost performance of flip chip is further improved, and the market penetration is increasing. In addition, with the popularity of LED lighting, the price of the entire industry chain continues to fall, and upstream chip companies with relatively high profits are no exception. The development of positive-loading chips is relatively mature, the market competition is extremely hot, and the price and profit rate continue to fall. Through the advancement of technological processes and the introduction of new products and shrinking chip size to obtain higher gross profit margin, it will become the common goal of LED chip manufacturers. Therefore, many of the performance advantages and cost advantages of flip chip are concerned by many LED lighting factories. Who stood on the flip-chip development trend? Although the advantages of flip chip are many, but now it is just emerging in China, the flip-chip technology is also in the hands of some international companies in the same industry. The domestic counterparts are currently engaged in research and development due to various limitations of technology, talents and equipment. The business is still not too much. Of course, there are also some companies that try first. Taking the cross-strait optoelectronics as an example, as early as 2011, the company was keenly aware of the LED packaging market trend, and began to enter the field of flip chip by combining the strategies of the industry and enterprises. We have extensively recruited professionals from all over the country, and set up a professional team of flip-chip COBs. We have introduced fully automated professional equipment such as solid crystal machine, soldering machine, dispensing machine, beam splitter, braiding machine and precision oven. We are fully committed to investing in it. In the research of chip packaging technology. After three years of painstaking research and painstaking exploration, the first COB series ceramic products of flip-chip products made a stunning appearance, and in the process of high-profile, they also solved the problem of flip-chip MLCOB technology and made flip chip fabrication. The filament product perfectly solves the problems of poor heat dissipation, collapse line, blue leakage and dead light in the filament of the dressing chip. It is reported that the current product line of cross-strait optoelectronics includes ceramic substrate series, aluminum substrate series, flip-chip filament, flip-chip MLCOB components, etc. These products have been tested and have entered mass production stage. At present, cross-strait optoelectronics products are shipped at 200 KK a month, and flip-chip products are currently shipping more than 1 KK per month, which is in short supply. Conclusion: At this stage, flip chip technology has many limitations, but with the continuous improvement of technology, and more and more people and companies are willing to try and innovate, I believe in the future, based on flip chip technology. The prospect of packaging products will be promising, and will be widely used in aerospace communications, automotive electronics, commercial and residential lighting, urban lighting projects, advertising decorative lighting and other applications. Small knowledge: Dressing chips: The earliest chip structure is also the chip structure commonly used in low-power chips. In this structure, the electrode is on top, and the material from top to bottom is: P-GaN, luminescent layer, N-GaN, substrate. Therefore, it is a formal dressing compared to flip-chip; flip-chip: In order to avoid the effect of the electrode squeezing the light-emitting area in the chip, which affects the light-emitting efficiency, the chip developer designed the flip-chip structure, that is, the flip chip is inverted, and the light-emitting layer is excited. The light is emitted directly from the other side of the electrode (the substrate is finally stripped, the chip material is transparent), and at the same time, the structure of the LED package factory wire bond is designed for the flip chip, and thus the entire chip is called a flip chip (FlipChip). ), the structure is currently used in high-power chips. Especially after the flip chip is applied in the field of LED packaging, the flip chip process has five distinct advantages compared to the conventional packaged chip. Deng Qiai, project manager of the two-storied optoelectronic flip chip, believes. First, after the flip-chip, the electrode directly contacts the heat-dissipating substrate, and does not pass through the sapphire heat dissipation, and can be used with a large current; the second is that the size can be made smaller, the optical is easier to match; the third is that the heat dissipation function is improved, and the life of the chip is extended; Wire the line to avoid the risk of disconnection; the fifth is to lay the foundation for the subsequent development of packaging process.