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Tungsten carbide pellets are small, cylindrical or spherical shapes made from tungsten carbide, a hard and dense material. These pellets are typically used in various industrial applications, such as drilling, grinding, cutting, and wear-resistant components.
Tungsten carbide is a compound of tungsten and carbon, known for its high hardness, strength, and resistance to wear and corrosion. It is often used as a cutting tool material, as well as in the production of mining and drilling equipment.
The pellets are usually produced through a process called powder metallurgy, where Tungsten Carbide Powder is mixed with a binder material and then compacted under high pressure. The compacted pellets are then sintered at high temperatures to form a solid and durable product.
Tungsten carbide pellets are used in various industries, including mining, construction, oil and gas, and manufacturing. They are commonly used as inserts in drilling bits, cutting tools, and wear-resistant parts, providing high performance and extended tool life.
Overall, tungsten carbide pellets are essential components in many industrial applications, offering superior hardness, strength, and wear resistance.
[China Instrument Network Instrument Development] High-speed imaging technology is one of the important research directions in the application of terahertz (THz) technology. Chinese scientists have succeeded in developing a THz frequency upconversion imaging chip capable of pixel-free imaging recently. The relevant research results have been published in the "Science Report", a subtitle of the British magazine "Nature."
The use of THz technology to develop high-speed imaging technology has important application value in material analysis, high-energy physics process analysis, biomedical imaging, human body security and so on. However, due to the lack of low-temperature matching readout circuits, the design of fast-response photon-type focal plane array detectors is very difficult. As a result, the research progress of THz high-speed and real-time imaging technologies is slow.
To solve this problem, the research team led by Cao Juncheng, a researcher of the Shanghai Institute of Microsystem and Information Technology of the Chinese Academy of Sciences, used molecular beam epitaxy to stack THz quantum well detectors (THz QWP) and light emitting diodes (LEDs). THz frequency upconversion imaging chip (THz QWP-LED) that can be image-free.
The successful development of the above-mentioned imaging chip is an important advancement of THz high-speed imaging technology, which is of great significance for the development of high-speed high-energy high-energy physical processes, material analysis, and biomedical imaging technologies.
(Original title: China successfully developed ultra-high-speed terahertz array imaging chip)